------- Mcoti hloov tau thermal pads thiab tsis yog-silicone thermal gels
Optical modules yog cov khoom tseem ceeb hauv kev sib txuas lus kho qhov muag uas hloov kho qhov muag thiab hluav taws xob teeb liab. Lawv tau siv dav hauv cov chaw khaws ntaub ntawv, kev sib txuas lus sib txuas lus, huab xam, 5G / 6G hauv paus chaw nres tsheb, thiab lwm yam xwm txheej. Lawv lub luag haujlwm tseem ceeb yog los hloov cov teeb liab hluav taws xob rau hauv cov teeb liab kho qhov muag (transmitter), xa lawv los ntawm cov khoom siv kho qhov muag xws li kho qhov muag fiber ntau, thiab tom qab ntawd hloov lawv rov qab rau hauv cov teeb liab hluav taws xob (receiver), ua kom ntev - nrug, siab - ceev cov ntaub ntawv xa mus. Optical module ntim nrog encapsulating Cheebtsam xws li transmitter optical module (TOSA), receiver optical module (ROSA), thiab printed circuit board assembly (PCBA) kom ua tiav kev hloov dua siab tshiab thiab kis tau tus mob optical thiab hluav taws xob teeb liab.
Nrog rau txoj kev loj hlob sai ntawm kev lag luam digital, optical modules tau hloov mus raukev ceev dua, kev siv hluav taws xob tsawg dua, me me, thiab cov nqi qis dua. Raws li lub cav tseem ceeb ntawm kev sib txuas lus kho qhov muag, kho qhov muag modules 'kev txhim kho thev naus laus zis yog ncaj qha tsav kev txhim kho hauv ntiaj teb cov ntaub ntawv xa mus tau zoo thiab yog cov khoom tseem ceeb hauv lub hnub nyoog digital.
Thaum tshav kub kub dissipation qhov chaw txwv nyob rau hauv tus qauv ntawm miniaturization
Qhov kev tsis sib haum xeeb ntawm kev ntim ntim thiab cov cua sov dissipation
Lub QSFP-DD pob ntsuas tsuas yog 18mm × 89mm × 8.5mm, tseem yuav tsum dissipate tshaj 20W ntawm tshav kub. Qhov no compresses lub dab dej kub fin qhov siab kom tsawg dua 3 hli, txo cov cua convection tshav kub hloov coefficient tsawg dua 50W / m²·K ntawm cua ceev ntawm 2m / s.
Thermal Resistance ntawm 3D Stacked Structure
Qhov ntsug stacking ntawm cov co- ntim tshuab kho qhov muag thiab cov khoom siv hluav taws xob ua kom ntev rau txoj kev tshav kub. Lub thermal tsis kam ntawm TIM interface ntawm txhua txheej txhawb ntau tshaj 60% ntawm tag nrho cov thermal kuj. Txoj kev sib tshuam - mus rau -ambient thermal resistance (Rja) ntawm 1.6T module yuav tsum tau tawg los ntawm kev lag luam bottleneck ntawm 1.5℃W.
Cov kev cai airtightness txwv tsis pub cov cua sov dissipation daws
TO-CAN hermetic ntim ntawm cov khoom siv kho qhov muag txwv kev siv siab -cov khoom siv hluav taws xob zoo xws li cov ntaub ntawv hloov pauv theem (PCMs) thiab cov hlau ua kua. Tsoos tooj liab microchannel txias daim hlau ntsib cov teeb meem hauv corrosion kuj thiab siab tsis kam.
Kev siv cov khoom siv thermal conductive hauv optical modules
Kev xav tau rau cov khoom siv thermal interface
- Tsis tshua muaj kev sib cuag nrog thermal tsis kam: Cov khoom siv tau yooj yim lossis fluidity (xws li, thermally conductive gel) ua rau qhov sib txawv ntawm lub ntsej muag, txo cov thermal kuj.
- Kev ntub dej zoo: Cov khoom siv lub ntsej muag yuav tsum sib haum nrog cov ntaub ntawv sib txawv, xws li hlau (xws li, aluminium alloy vaj tse), ceramics (xws li, laser tej pob khoom), thiab PCBs, kom ntseeg tau tias nruj haum tsis muaj npuas seem.
- Tsim nyog hardness thiab compressibility: Cov khoom tuaj yeem sau qhov khoob yam tsis muaj kev puas tsuaj rau cov khoom muag (xws li, fiber ntau optic connectors thiab solder pob qij txha) vim yog compression ntau dhau.
- Tsawg volatility thiab tsis yog -corrosiveness: Cov khoom muaj ib tug tsis tshua muaj volatile organic compound (VOC) cov ntsiab lus thiab tsis muaj corrosive Cheebtsam xws li silicone migrants thiab halogens, tiv thaiv kom txhob muaj kab mob ntawm optical Cheebtsam (xws li, lo ntsiab muag thiab fiber optic connectors) los yog corrosion ntawm PCB solder pob qij txha.
Pom zoo Mecotech Thermal Conductive Materials
Plexible Thermal Pads: N-SP88 Series
Thermal conductivity ncav cuag 10.0 W / m·K thiab tswj cov thermal conductivity zoo heev txawm tias nyob rau hauv qis qis. Cov khoom no kuj tseem muaj qhov tsis muaj zog, ua rau nws tsim nyog siv rau hauv thaj chaw uas muaj kev cuam tshuam rau qis -molecular- hnyav hnyav.
- Silicone Mos Thermal Pads
- Thermal conductivity nce mus txog 10 W / m·K
- Kev ua tau zoo ntawm hluav taws xob rwb thaiv tsev: Dielectric zog Ntau dua lossis sib npaug li 10kV / mm
- Zoo them nyiaj rau cov khoom sib txawv flatness sib txawv
- Haum rau siab- cov khoom rhiab heev
Tsis yog -Silicone Thermal Gel: 8745NS
Cov khoom tsis yog-silicone tsis tso tawm siloxane, uas tuaj yeem ua rau cov khoom sib kis. Siloxane deposition tuaj yeem ua rau hluav taws xob tiv thaiv hluav taws xob thiab tiv thaiv kev tiv thaiv ntau ntxiv. Tsis yog -silicone gel tshem tawm cov kab mob silicone, kom ntseeg tau ntev -lub sij hawm.
- Siab thermal conductivity: 4.5 W / m·K
- Tsawg thermal tsis kam: 0.21℃.cm²
- Vertical stability tom qab sib dhos thiab kev laus: Tsis muaj kev hloov pauv loj
-H kub thiab av noo 1000 teev @ 85℃/ 85% RH
-Kev kub siab ci 1000 teev @ 125 degree
- Zoo heev thermal kuj zoo sib xws tom qab kev laus:
-H kub thiab av noo 1000 teev @ 85℃/ 85% RH
-Kev kub siab ci 1000 teev @ 125 degree
- Kub poob siab 1000 teev @ -40℃txog 85 degree
- Tsawg compressive kev nyuaj siab
- Tsis tshua muaj roj seepage: Tsis muaj roj seepage tau pom tom qab ci ntawm chav tsev kub, 85 degree, thiab 100℃rau 24 teev.
